EPON™ Resin 8281 was developed for use in formulating highly filled compounds, particularly those with high levels of silica-type fillers. This resin allows the formulator to compound materials suitable for use in a wide variety of products, including adhesives, electrical encapsulants and molding compounds, tooling compounds, and most construction end uses. Benefits include:

• Excellent resistance to pigment and filler settling
• Low saponifiable chlorine level
• Superior resistance to foaming under vacuum
• Viscosity stability comparable to other conventional liquid EPON Resins

EPON™ Resin 872 is a chemically modified BPA based epoxy resin that is semi-solid at room temperature. Systems using EPON Resin 872 can be formulated with other EPON Resins, HELOXY™ Modifiers, or used as the sole resin to provide varying degrees of flexibility and toughness. EPON Resin 872 is especially useful in applications requiring extra resistance to thermal shock or impacts. Benefits include:

• May be blended with other epoxy resins
• Semi-solid at room temperature, pourable at mildly elevated temperatures
• May be used to produce potting and encapsulants of high thermal shock resistance
• Improved toughness and flexibility over unmodified liquid epoxies