Resins

Miller-Stephenson offers a diverse line of Epoxy Resins, Curing Agents, Modifiers, Blends and Specialty Systems. These products vary in chemical structure, molecular weight, viscosity and functionality, providing the formulator with a multitude of options. There is at least one resin system that can be used to achieve a specific property or combination of properties, whether it be low viscosity, chemical resistance, reactivity, flexibility, heat resistance or fire retardance. Our Technical Service Department is available to answer your questions. In the US, call 1.800.992.2424 (8-4 E.T.). In Canada, call 1.800.323.4621 (8-4 E.T.). If outside the U.S. and Canada, call 203.743.4447 (8-4 E.T.) or e-mail: support@miller-stephenson.com

LIQUIDS & BLENDS offer low to moderate room temperature viscosities. They have the best balance of handling, reactivity and performance properties. EPON™ Resins with lower viscosity offer better wetting and higher filler acceptance. Their moderate viscosities offer better deflection temperature at elevated temperatures and in applications requiring maximum chemical resistance. EPONOL™ Resins do not require curing agents. They are excellent film formers and can produce outstanding surface coatings by solvent evaporation alone.

MODIFIERS offer improved cured system flexibility, increased peel and impact strength, increased filler loading, improved resin wetting action and reduced viscosity and surface tension. HELOXY™ Modifiers and CARDURA™ Glycidyl Ester provide unique benefits for epoxy resin formulations.

SEMI-SOLIDS & SOLIDS have a higher molecular weight, providing reduced heat exotherm and a slight improvement in adhesion and cracking resistance. These EPON™ Resins are often used for large encapsulations and in maintenance coatings.

ELECTRICAL LAMINATING resins include EPON™ brominated resins and HELOXY™ brominated resins. They can be used to obtain fire retardance in a base epoxy resin formulation.

SPECIALTY & MULTIFUNCTIONAL resins include NOVOLAC™ and EPONEX™ Resins for increased levels of heat and chemical resistance and elastomer modified resins for increased flexibility, adhesion and fatigue resistance.

WATERBORNE SYSTEMS offer flexibility and toughness with water clean-up, low VOC's, reduced surface preparation, wet surface application, excellent substrate wetting and fast drying time. EPIREZ™ Waterborne systems are not subject to government regulations and the costs associated with solvent based systems.

CURING AGENTS can be selected for increased mechanical strength, water resistance, chemical resistance, gloss, adhesion and low temperature cure. To achieve your desired performance, there are many EPIKURE™ Curing Agents available.

Filler CAB-O-SIL® Silica epoxy thickening agent provides a reduction of peak exotherm temperatures, reduces the overall shrinkage during curing, and reduces the coefficient of thermal expansion.